Clemson University

The Future of Flexo: New Year, New Technology presented by OMET

The Future of Flexo: New Year, New Technology

Join us for a FREE open house on Feb. 6-7 presented by OMET Americas at Clemson University's Sonoco Institute.

  • Connect with vendors from across the flexo industry to explore their latest technologies
  • Determine which industry advancements to consider for your 2019 budget planning
  • Join Durst-led discussions around digital inkjet technology,   capabilities and justification
  • Enjoy speakers, vendors, industry networking and free food 

Join us in beautiful Clemson, SC at the Sonoco Institute of Packaging Design and Graphics, the premiere source of talent and discovery for printing and packaging innovation. The Institute's Advanced Print Lab, which houses OMET's Varyflex narrow-web press, provides a hub for industry suppliers, brand owners and others to gather and get their hands on the latest technologies. 

Sponsored by Phoseon, Harper, Nazdar, Siegwerk, Eaglewood, DuPont, Techkon, DBT CoatingsOMET and Clemson University.

Please click the orange BUY TICKETS button to RSVP everyone in your party for free. 

Agenda / Shuttle Info:

Thursday, February 7, 2019 at 9:00am to 3:00pm

Sonoco Institute at Clemson University 311 Harris A. Smith Building

Event Type

Lectures / Seminars / Speakers, Special Events


Centers and Institutes, Sonoco Institute of Packaging Design and Graphics, College of Business

Target Audience

General Public



Contact Name:

Ron Hengst

Contact Phone:


Contact Email:


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هيثم فتحي

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